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"Shortcomings of the STL format in terms of processing time and object dimensional precision are a barrier for the production of complex, high-precision parts ... this format only allows geometric representation, so it does not allow voxel-by-voxel information to be carried from the CAD software to the printer. To realize the full potential of 3D printing, the roadmaps of 3D printers and 3D CAD software must be aligned, and the roadmaps must be accompanied by a change to a more information-rich file format."

To me, this right here is the heart of the white paper. If they want their machine to stand apart from polyjet (Objet) technology by printing with per-voxel control of multiple materials (very similar to Objet's digital materials [0]), then they're going to have to create a new workflow for engineers to design with (which was not detailed in the whitepaper other than this mentioning of a new kind of file format needed to handle the design information). Particularly, is the design workflow going to allow for finite element analysis (FEA) of both geometry and material? People are already creating CAD software that will allow for user-friendly FEA of geometry [1], but I'm not sure if anyone is working on FEA of both geometry and material. If HP can develop that solution, that right there would be a legitimate breakthrough.

[0]: http://www.stratasys.com/materials/polyjet/digital-materials [1]: https://www.youtube.com/watch?v=MU3W-RrJDT4#t=327




I am working on this product. It really is awesome: the level of excitement among the engineers reminds me of the HP of 15 years ago. And I completely agree with your assessment. Figuring out the right workflow is going to be the cornerstone, not only for our printer but for the future of the industry.


>Figuring out the right workflow is going to be the cornerstone

Rule 1. There is more than one workflow.


Pretty please: Make sure there is proper software for at least Linux or OSX.


printing electrical circuits on something robust enough to use in a production device would be pretty killer IMHO. (Solid yet thin plastic base, enough conductive material to not get scratched off too easily).


Where is the development happing? SF or Barcelona?


Barcelona, with teams in Palo Alto and San Diego.


It's not too hard to separate 2 colors. (Just have separate STL files for each color). I do this currently.

I don't think many designs will really require "pixelized" variations in color like their demo shows. Just putting a transparent layer, or 5 colors, will provide for ~80% of predicted use cases. So, a simple "STL per color" format can act as a "bridge" until the necessary richer standard is developed & adopted.




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