I think the setup in GP is something like 0.1uF tantalum + 47uF electrolytic. 0.1uF stops CPU crashing and electrolytic stops CPU passing out. Tantalum fails in shorting mode and have since been replaced with ceramics that fail open, of course.
> I think the setup in GP is something like 0.1uF tantalum + 47uF electrolytic. 0.1uF stops CPU crashing and electrolytic stops CPU passing out.
You might find a configuration like that in some old retro computing gear, but a modern 1uF ceramic chip capacitor will outperform a 0.1uF tantalum significantly. You don't need to use an electrolytic for 47uF. You can get 47uF in one or two surface mount ceramic caps.
I was surprised to find that you can, indeed, get 47 uF 35 volt MLCC surface mount caps, but they'll set you back about 10x the cost of the same capacitance in a surface mount electrolytic. In some cases, it might be worth it.
Most of the repairs I do are to older test equipment and radios, from WWII to the end of the 20th century. Some of the new surface mount stuff is just too small for us to work with. 6TTSOP is a chip 2 by 1.25 mm, and it's really hard to tack leads onto it to patch it into an existing circuit. (We needed 20+ dB of gain at 2 Ghz to replace an obsolete part, we ended up ordering a MAR-6+ instead, at least it's big enough to solder)
You should probably stock up on breakout boards in your most frequently used chip form factors. They're usually fairly cheap and can save you most of the pain of avoiding shorting pins on floating chips.
True. Couple big ceramic caps on the secondary side of power circuit and cheapest 0.1uf peppered around is going to make sense. Chip mounter machines probably like it too.
