> Simple, you wipe them off when you change the heatpaste.
That doesn't work so well for BGA packages. I'd need to do some research to see if reflowing the solder would fix a low level of tin whiskers. Usually, the flux effectively increases the surface tension of the solder, causing it to form nicely around the pads and contacts. So it isn't clear to me how well the reflow will work without additional flux.
That doesn't work so well for BGA packages. I'd need to do some research to see if reflowing the solder would fix a low level of tin whiskers. Usually, the flux effectively increases the surface tension of the solder, causing it to form nicely around the pads and contacts. So it isn't clear to me how well the reflow will work without additional flux.