It has been rumored for quite awhile. Chiplets from multiple vendors and on package memory (HBM) will be the way all future high end chips will be built. The key to getting this right is getting the handoff between devices at a systems level and extending the virtual memory fabric cleanly to these devices. The win for these is that you get the best hardware out there on A high bandwidth low latency substrate. AMD has better GPU hardware than Nvidia (Nvidia just has better drivers). Intel still has an edge on CPU physical implementation so, why not combine. I fully expect to see custom accelerators (TPU-like things in he near future) incorporated as well. If companies like IBM and Arm were smart they’ll be entering the space too, selling IP to put over EMIB. Suspect IBM is already there :), Arm probably not.